advanced packaging of chiplets and heterogeneous integration in Europe

Within the framework of the Digital Europe Programme (DIGITAL), the call "Boosting cooperation for industrial implementation on advanced packaging of chiplets and heterogeneous integration in Europe" supports coordination and support actions (Coordination and Support Action – CSA). The goal is to establish a resilient, sustainable, and competitive European ecosystem for advanced packaging of chiplets and heterogeneous integration. Applicant organizations from all EU Member States – ranging from companies to non-profit and public institutions as well as educational institutions and foundations – can benefit from funding rates of up to 100%. With a total budget of €500,000 to €2,000,000 per project, activities in the fields of research & innovation as well as digitalization are supported. The submission deadline runs from 3 December 2025 to 25 February 2026 (17:00 Brussels time). The application must include, among other documents, the Call Document, the Guide for Applicants, Application Form Part B, and an Ownership Declaration.

The funding is particularly aimed at research institutions, industrial companies, pilot lines, competence centers, and existing networks that jointly seek to strengthen the entire value chain of advanced chiplet packaging. Key funding priorities focus on the standardization and interoperability of technologies, knowledge exchange, qualification of a specialized workforce, and harmonization of EU research and industrial activities. Demonstrably more resilient and diversified supply chains, a reduced ecological footprint in manufacturing, and accelerated market introduction of innovative packaging solutions are desired. Through coordinated collaborations and an aligned roadmap for industrial implementation, long-term synergies between science and industry will be created to establish Europe as a pioneer in the field of advanced packaging.