Chips Act - First of a Kind Production Facilities

The Chips Act – First of a Kind Production Facilities funding supports companies, cooperatives, foundations, and non-profit organizations with an operating base in Vienna in establishing novel semiconductor production capacities. The goal is to build Integrated Production Facilities (IPF) and open EU Foundries (OEF) within the framework of Pillar 2 of the EU Chips Act to strengthen supply security and consolidate Europe as an innovation hub. Expressions of interest can be submitted at any time; the submission deadline is 31.12.2026. The funding is provided as a non-repayable grant and is aimed at legal entities or partnerships outside the federal administration without outstanding repayment claims from the EU Commission.

Investments in tangible and intangible assets that demonstrably contribute to the realization of first-of-a-kind projects in Vienna, as well as services for the project portfolio and financing gap calculation, are eligible for funding. Preparatory work prior to approval and non-allocable costs are not eligible. The application requires a detailed project description, a financing gap calculation, and the use of the EUCA Project Descriptions Template. Selection is based on innovation content, contribution to supply security, first-of-a-kind criterion, economic sustainability, and job creation. After positive national evaluation and EU notification, the grant agreement is concluded by Austria Wirtschaftsservice (aws). This program offers companies of all sizes the opportunity to pioneer in a forward-looking technology field and to strengthen European semiconductor manufacturing in the long term.