Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration

The funding program Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration targets companies, educational institutions, and public entities within the EU that aim to transfer innovative packaging technologies and heterogeneous integration solutions for the semiconductor industry from the laboratory to industrial manufacturing. With a grant volume ranging from €500,000 up to €15,000,000 per project, the initiative seeks to build a competitive European ecosystem and strengthen resilient supply chains. By involving relevant stakeholders along the value chain – from material and substrate manufacturers to equipment and testing service providers, as well as production facilities – a powerful network is created that accelerates technology transfer and ensures the industrial applicability of advanced packaging solutions.

Eligible for funding are SMEs as well as research institutions based in an EU member state, which jointly submit a project and involve relevant stakeholders along the packaging value chain. Eligible costs include personnel expenses, material costs, travel expenses, and subcontractor services. Evaluation is based on the criteria of Excellence, Impact and Dissemination, and Quality of Implementation. The submission deadline is February 25, 2026 (17:00 GMT+2). To apply, the Guide for Applicants, the Application form Part B, the National Budget table, and the Ownership declaration template must be submitted. By accelerating the transfer of pilot plants into production, the program sustainably contributes to strengthening the European semiconductor industry.